1. Introduction of RO4003C

Rogers RO4003C laminates deliver superior RF performance through a proprietary ceramic-hydrocarbon/glass reinforcement system, matching PTFE/woven glass electrical properties while maintaining epoxy/glass manufacturability. These cost-effective microwave materials are available in 1080 and 1674 glass styles, providing tight Dk control and low loss without requiring special PTFE processing methods.

RO4003C 's copper-matched CTE ensures exceptional dimensional stability for multilayer designs, while its >280°C Tg maintains performance across extreme processing temperatures. Though non-brominated and not UL 94 V-0 rated, RO4003C PCB offers reliable plated through-hole integrity even under thermal shock conditions - making it ideal for high-reliability RF applications where standard FR-4 processes are preferred.

2.1 Features (RO4003C)

- Dielectric Constant of DK 3.38 +/-0.05 at 10GHz

- Dissipation Factor of 0.0027 at 10GHz, 0.0021 at 2.5GHz.

- Thermal Coefficient of dielectric constant of +40 ppm/°C

- Thermal Conductivity 0.71 W/m/°K

- X axis CTE of 11ppm/°C, Y CTE of 14ppm/°C, Z CTE of 46ppm/°C

- Low moisture absorption of 0.06%

- Ideal for multi-layer board (MLB) constructions

- Processes like FR-4 at lower fabrication cost

- Designed for performance sensitive, high volume applications

- Competitively priced

2.2 Features (S1000-2M)

-Lower Z-Axis CTE for improved throughhole reliability

-Excellent Mechanical Processability andThermal Resistance

-Leadfree Compatible

-Tg180℃ (DSC), UV Blocking/AOI compatible

-High heat resistance

-Excellent Anti-CAF performance

-Low water absorption

3. PCB Stackup: 6-layer rigid PCB

Copper_layer_1 - 35 μm

RO4003C - 0.508 mm (20mil)

Copper_layer_2 - 35 μm

Prepreg - 1080 X2 RC63% 0.127mm (5mil)

Copper_layer_3 - 35 μm

S1000-2M - 0.508 mm (20mil)

Copper_layer_4 - 35 μm

Prepreg - 1080 X2 RC63% 0.127mm (5mil)

Copper_layer_5 - 35 μm

S1000-2M - 0.508 mm (20mil)

Copper_layer_6 - 35 μm

5. PCB Statistics:

  Components:        122

  Total Pads:         447

  Thru Hole Pads:     229

  Top SMT Pads:      218

  Bottom SMT Pads:    0

  Vias:              138

  Nets:              8